1、刘强，夏建文，李绪军，孙德亮，黄明起等.面向超薄器件加工的临时键合材料解决方案[J],集成技术，2021,10（1）:23-34.
2、苏星宇, 黄明起, 刘彬灿,张国平. 新型化学镀钯工艺研究. 印制电路信息[J], 2019, 27(03):12-18.
3、张国平，夏建文，刘强，黄明起，陈伟，孙蓉，汪正平，面向超薄柔性器件加工的激光解键合方案[J], 纺织学报. 2018，5（39），155-159.
4、Jinhui Li;Qiang Liu;Guoping Zhang;Bin Zhao;Rong Sun;Ching-Ping Wong. Thermally Reversible and Crosslinked Polyurethane Based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-Temperature[C],Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th，746-751.
5、Jianwen Xia,Guoping Zhang,The effect of curing process on laser releasable de-bonding temporary material for 3D packages[C],International Conference on Electronic Packaging Technology (ICEPT),2017,1533-1536
6、Mingqi Huang,Xiantang Li,Jianwen Xia,Xiaohai Li,Wenyu Qiu,Guoping Zhang,Rong Sun,Yong Mu.A Conceivably stable non-cyanide electroless gold plating for electronic packaging application[C],International Conference on Electronic Packaging Technology (ICEPT),2017,1173-1178.
7、Qiang Liu,Guoping Zhang,Rong Sun,S.W.Ricky Lee，C.P.Wong.Investigation the effect of silane onto fabricating polymer insulation layer by spin-coating for through silicon vias[C],International Conference on Electronic Packaging Technology (ICEPT),2017,1537-1541
8、Qiang liu,Guoping Zhang,Rong Sun,S W Ricky Lee.influence of rubber nanoparticles on the properties of Navolac-diazonaphthoquinone based photoresist[C],International Conference on Electronic Packaging Technology (ICEPT),2015,1039-1042
9、Libo Deng,Haoming Fang,Xingtian Shuai,Rong Sun,Preparation of reversibie thermosets and their application in temporary adhesive for thin wafer handin[C],Electronic Components and Technology Conference(ECTC),2015,1197-1201
10、Xingtian Shuai, Rong Sun, Guoping Zhang, Libo Deng. A novel temporary adhesive for thin wafer handling[C],Electronic Packaging Technology (ICEPT), 2014, 256-261
11、帅行天，张国平，邓立波，孙蓉，李世球，汪正平，用于薄晶圆加工的临时键合胶[J]，集成技术，2014,6,102-110.
12、Lulu Zhuang,Kun Jiang,Guoping Zhang,Jiaoning Tang,Rong Sun, S W Ricky Lee,O2 Plasma Treatment in polymer insulation process for Through silicon vias[J],International Conference on Electronic Packaging Technology(ICEPT),2014,235-238